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About Me

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About

As a scientist, I am passionate about exploring the mysteries of the universe. With more than 11-year scientific research training as a graduate student or a postdoc, I have obtained extensive research experience in materials science and engineering, electrical engineering, mechanical engineering, and bioengineering, specifically in electronic packaging, sensor integrations, soft wearable electronic device design, manufacturing, and assembling, and reliability engineering.

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This website is a showcase of my professional experience and accomplishments. Here, you can learn more about my work and my journey as a scientist.

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Education

2008-2015

B.E. in Electronic Packaging Technology,

M.E. in Materials Science and Engineering,

Beijing Institute of Technology

Beijing, China

2015 - 2021

Ph.D. in Materials Science and Engineering,

University of California San Diego

La Jolla, CA​

2021 - 2024

Postdoctoral Associate, 

Associate Research Scientist

Yale University

New Haven, CT

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Professional Associations

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2021-Now

IEEE Electronic Packaging Society (IEEE EPS)

2018-Now

Materials Research Society (MRS)

2021

Guest Editor in Electronics

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Scholarly Presentations

MRS meetings (2021)

Three-dimensional transistor arrays for intra- and inter-cellular recording

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Yale Women Health Summit (2023)

CMOS nanowire biosensor for early detection of breast cancer

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IEEE Electronic Components and Technology Conference (2024)

A CMOS nanosensing system for continuous brain multianalyte monitoring

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7th Yale Epilepsy Retreat (2023)

A Multimodal Neuroprobe for Multiplexed Brain Physiology Monitoring

12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT 2011)

Image: With Dr. Yongjun Huo and Dr. Rao Tummala

More​​

  1. Invited guest lecture at Vanderbilt University, titled "Stretchable electronics by compressive buckling technique", 2023 Nov, hosted by Prof. Xiaoguang Dong at Vanderbilt University. 

  2. Invited talk at IEEE EPS webinar, titled "Stretchable electronics by soft packaging techniques", 2023 Nov, hosted by Dr. Yang Liu at Nokia Bell Labs. 

  3. Invited guest lecture at Tufts University, titled "Rubber-Like Soft Electronic Devices", 2020 Nov, hosted by Dr. Huan-Hsuan Leo Hsu at Tufts University. 

  4. Invited guest lecture at Preuss School, titled "Rubber-Like Soft Electronic Devices", 2017, La Jolla. 

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