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Image by John Fowler

KEY SKILLS

Electronic Packaging Design

Process Development (Microfabrication)

Reliability Test

Failure Analysis

Sensor Development

Semiconductor Testing

Silicon Device Manufacturing

Medical Device Engineering

Volume Manufacturing

Project Management

Image by John Fowler

Technical skills

Electronic packaging: 12+ years of experience (2011~now)

  • PCB design (12+ YOE): PCB layout design of surface mounting chips in Altium Designer or CAD tools.

  • PCB manufacturing (12+ YOE): PCB milling (PCB router), Screen printing, UV exposure, Development.

  • IC chip assembly (12+ YOE): Wire bonding, Die bonding, Surface mount technology/SMT.

  • BEOL (3+ YOE): Molding (QFP or QFN packages), Singulation/Dicing.

Process engineering and product development: 8+ years of experience (2015~now)

  • Transistors engineering (8+ YOE): FET and CMOS sensors design and fabrication using conventional micro/nano-fabrication technologies, including lithography, RIE/ICP etching, deposition (sputtering, PVD, ALD), design of experiments and process optimization towards yield improvements.

  • Semiconductor testing (8+ YOE): Validation of FET’s output and transfer characteristics using probe station and semiconductor parameter analyzer.

  • Testing automation (3+ YOE): Automated testing using python scripted program control.

  • Data processing and visualization (8+ YOE): MATLAB, Python.

Reliability test and failure analysis: 12+ years of experience (2011~now)

  • Microscopy (12+ YOE): Optical microscopy/OM, Scanning electron microscopy/SEM, Transmission electron microscopy/TEM, Atomic force microscopy/AFM, Film profiler (Dektak, Filmetrics, etc.), XRay.

  • Analytical chemistry (12+ YOE): SEM/EDX, XRD, FTIR, XPS.

  • Acceleration/aging tests (3+ YOE): Thermal cycling, Electrical stress (Electromigration), Corrosion stress.

  • Mechanical tests (3+ YOE): Ball-pull, Ball-shear, Chip shear, Solder wettability.

  • Simulations (3+ YOE): 3D Modeling with CAD tools (SolidWorks), Finite-element analysis (ANSYS, Abaqus).

Bio-sensors development (catheter probe for human brain monitoring): 8+ years of experience (2015~now)

  • Bio-sensor design (8+ YOE): Passive (electrochemical sensors) and active (transistors) design towards the required sensitivity and selectivity, including structure design (2D/ 3D modeling) in SolidWorks and AutoCAD.

  • Mass-production (8+ YOE): Using micro/nano-fabrication techniques including lithography, RIE/ICP etching, deposition (sputtering, PVD, ALD), design of experiments and process optimization towards yield improvements.

  • Testing automation (3+ YOE): Automated testing using python scripted program control.

  • Implantable device manufacturing (2+ YOE): Specifications determination and assembling multiple sensors into a multi-lumen flexible catheter, including 3D printing sensor carriage, soldering, and reflowing.

Medical device packaging and sterilization: 2+ years of experience (2022~now)

  • Packaging (2+ YOE): DOE for packaging conditions (e.g., humidity), towards a product shelf life up to 6 months.

  • Sterilization (2+ YOE): Experience with ethylene oxide, ebeam irradiation, steam/autoclave, and Sterrad.

Translation of in-house build medical device: 2+ years of experience (2022~now)

  • Animal model study (2+ YOE): Biosafety, device performance tests in rats, e.g., sacrificial and survival studies.

  • Comparison research (2+ YOE): Compare performance of the in-house built device with predicate devices.

  • Investigational Device Exemption (IDE) (1+ YOE): Prepare testing plan and step-by-step protocols for FDA.

Testing fixture engineering: 2+ years of experience (2022~now)

  • Design (2+ YOE): 2D/ 3D modeling in SolidWorks and AutoCAD.

  • Fabrication (2+ YOE): Make the fixture in 3D printing and/or laser cutting.

  • Biological: (3+ YOE)

  • Myocyte and cell line culture, Patch clamping, Confocal microscope, Immunofluorescent (IF) staining, Live/Dead assay.

Communications and teamwork

  • Project planning, Project management, Teaching and mentoring

  • Language: English (Full Professional) and Chinese (Native)

Contact

I'm always looking for new and exciting opportunities. Let's connect.

858-766-8154

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