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Research Background

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Current (PHASE III): Implantable Device for Human Brain
As a postdoc and tech/engineer lead in Yale Clinical Neuroscience Neuroanalytics Lab, I'm leading researches on the creation and production of electronic and photonic sensors and intelligent systems that can be used for biomedical purposes, such as diagnosing and treating epilepsy, brain trauma, and detecting cancer markers. I'm fully involved in the tranlational process of a implantable device, and understand the design control, quality management, and pre-FDA validation processes. 

PHASE II: PhD at UCSD- Soft wearable Electronics
My PhD training was centered on Materials Science and Engineering, with a specific focus on developing bio-sensors, including soft and wearable energy harvesters (fuel cells), thermo-modulators (thermoelectric), medical devices, and single-cell electrical signal recorders. My expertise spans across multiple fields, including materials science, electrical engineering, mechanical engineering, bioengineering, and CNS functions.

Phase I: Before PhD (Master and Bachelar)- Electronic Packaing Technologies and Materials
During the early stages of my academic career, I concentrated on electronic packaging technologies and reliability/failure analysis (thermal, mechanical, electrical reliabilities tests and FA). In particular, I designed and prepared nanomaterial-composite lead-free solder alloys for flip chip and BGA chip packaging. 

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Publications

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Publication list
(full list in Google Scholar)

Leading work: first author, co-first author, and second author

  1. Y. Gu, and Y. Huo, "Advanced electronic packaging technology: from hard to soft." Materials 16(6), 2023. (URL: https://doi.org/10.3390/ma16062346)

  2. Y. Gu, C. Wang, J. Zhang, J. Stowe, et al., "Three-dimensional transistor arrays for intra- and inter-cellular recording." Nature Nanotechnology 17(3), 2021. (URL：https://www.nature.com/articles/s41565-021-01040-w)

  3. Y. Gu, X. Zhao, Y. Li, Y. Liu, Y. Wang, et al., "Effect of nano-Fe2O3 additions on wettability and interfacial intermetallic growth of low-Ag content Sn-Ag-Cu solders on Cu substrates." Journal of Alloys and Compounds 627, 2015. (URL：https://www.sciencedirect.com/science/article/abs/pii/S0925838814028837)

  4. S. Hong, Y. Gu, J. K. Seo, J. Wang, P. Liu, et al., "Wearable thermoelectrics for personalized thermoregulation." Science Advances 5(5), 2019. (URL: https://www.science.org/doi/full/10.1126/sciadv.aaw0536)

  5. Y. Lei, Y. Chen, Y. Gu, C. Wang, Z. Huang, et al., "Controlled Homoepitaxial Growth of Hybrid Perovskites." Advanced Materials 30(20), 2018. (URL: https://onlinelibrary.wiley.com/doi/abs/10.1002/adma.201705992)

  6. H. Gong, F. Chen, Z. Huang, Y. Gu, Q. Zhang, et al., "Biomembrane-Modified Field Effect Transistors for Sensitive and Quantitative Detection of Biological Toxins and Pathogens." ACS Nano 13(3), 2019. (co-first) (URL: https://pubs.acs.org/doi/abs/10.1021/acsnano.9b00911)

  7. A. M. V. Mohan, N. Kim, Y. Gu, A. J. Bandodkar, et al., "Merging of Thin- and Thick-Film Fabrication Technologies: Toward Soft Stretchable “Island–Bridge” Devices." Advanced Materials Technologies 2(4), 2017. (co-first)

  8. A. J. Bandodkar, J.-M. You, N.-H. Kim, Y. Gu, et al., "Soft, stretchable, high power density electronic skin-based biofuel cells for scavenging energy from human sweat." Energy & Environmental Science 10(7), 2017. (co-first) (URL: https://pubs.rsc.org/en/content/articlelanding/2017/ee/c7ee00865a/unauth) 

  9. Y. Gu, Y. Liu, X. C. Zhao, et al., "Effects of Cobalt Nanoparticles Addition on Shear Strength, Wettability and Interfacial Intermetallic Growth of Sn-3.0Ag-0.5Cu Solder during Thermal Cycling." Materials Science Forum 815, 2015.

  10. Y. Gu, X. Zhao, Y. Liu and Y. Lv, "Preparation and Tribological Properties of Dual-Coated TiO2 Nanoparticles as Water-Based Lubricant Additives." Journal of Nanomaterials 2014, 2014. 

  11. Yang, M., Li, G., Gu, Y. et al. "Liquid metal-based flexible and wearable thermoelectric cooling structure and cooling performance optimization." Sci. China Mater. 66, 4001–4011 (2023). https://doi.org/10.1007/s40843-023-2607-3

Collaborative work

  1. H. Hu, H. Huang, M. Li, X. Gao, L. Yin, R. Qi, R. Wu, X. Chen, Y. Ma, K. Shi, C. Li, T. Maus, B. Huang, C. Lu, M. Lin, S. Zhou, Z. Lou, Y. Gu, et al., "A wearable cardiac ultrasound imager." Nature 613(7945), 2023. (URL: https://www.nature.com/articles/s41586-022-05498-z)

  2. Lin, M., Zhang, Z., Gao, X. et al. "A fully integrated wearable ultrasound system to monitor deep tissues in moving subjects." Nat Biotechnol 42, 448–457 (2024). https://doi.org/10.1038/s41587-023-01800-0

  3. X. Gao, X. Chen, H. Hu, X. Wang, W. Yue, J. Mu, Z. Lou, R. Zhang, K. Shi, X. Chen, M. Lin, B. Qi, S. Zhou, C. Lu, Y. Gu, et al., "A photoacoustic patch for three-dimensional imaging of hemoglobin and core temperature. " Nature Communication 13(7757), 2022.

  4. Y. Lei, Y. Li, C. Lu, Q. Yan, H. Gong, S. Zhang, J. Zhou, R. Zhang, Y. Chen, H. Tsai, Y. Gu, et al., "Perovskite superlattices with efficient carrier dynamics" Nature, 608(317-323), 2022. 

  5. Z. Hou, X. Zhao, Y. Gu, C. Tan, Y. Huo, S. Shi, Y. Liu, "Enhancement mechanism of Te doping on microstructure, wettability and mechanical properties of Sn–Bi-based solder" Materials Science and Engineering: A, 2022. 

  6. C. Wang, B. Qi, M. Lin, Z. Zhang, M. Makihata, B. Liu, S. Zhou, Y. Huang, H. Hu, Y. Gu, et al., "Continuous monitoring of deep-tissue haemodynamics with stretchable ultrasonic phased arrays" Nature Biomedical Engineering 5(7), 2021. (URL: https://www.nature.com/articles/s41551-021-00763-4)

  7. H. Hu, Y. Ma, X. Gao, D. Song, M. Li, H. Huang, X. Qian, K. Shi, H. Ding, M. Lin, X. Chen, W. Zhao, B. Qi, S. Zhou, R. Chen, Y. Gu, et al., "Stretchable ultrasonic arrays for the three-dimensional mapping of the modulus of deep tissue". Nat. Biomed. Eng 7, 1321–1334 (2023). https://doi.org/10.1038/s41551-023-01038-w

  8. X. Ma, S. Ahadian, S. Liu, J Zhang, S. Liu, T. Cao, W. Lin, D. Wu, N.R. Barros, M.R. Zare, S.E. Diltemiz, V. Jucaud, Y. Zhu, S. Zhang, E. Banton, Y. Gu, et al., "Smart contact lenses for biosensing applications." Advanced Intelligent Systems 3(5), 2021.

  9. X. Chen, X. Gao, A. Nomoto, K. Shi, M. Lin, H. Hu, Y. Gu, et al., "Fabric-substrated capacitive biopotential sensor enhanced by dielectric nanoparticles." Nano Research, 2021. 

  10. Y. Chen, Y. Lei, Y. Li, Y. Yu, J. Cai, M.-H. Chiu, R. Rao, Y. Gu, et al., "Strain engineering and epitaxial stabilization of halide perovskites." Nature 577(7789), 2020. (URL: https://www.nature.com/articles/s41586-019-1868-x)

  11. Y. Lei, Y. Chen, R. Zhang, Y. Li, Q. Yan, S. Lee, Y. Yu, H. Tsai, W. Choi, K. Wang, Y. Luo, Y. Gu, et al., "A fabrication process for flexible single-crystal perovskite devices." Nature 583(7818), 2020. (URL: https://www.nature.com/articles/s41586-020-2526-z)

  12. Z. Hou, X. Zhao, Y. Liu, C. Tan, Y. Gu, "Comparative study on the hourglass-like joint of electroplated Sn-base solder reinforced by adding Ag3Sn nanoparticles and Ag micro-alloying elements" Materialia, 9, 2020. 

  13. Z. Huang, Y. Hao, Y. Li, H. Hu, C. Wang, A. Nomoto, T. Pan, Y. Gu, et al., "Three-dimensional integrated stretchable electronics." Nature Electronics 1(8), 2018. (URL: https://www.nature.com/articles/s41928-018-0116-y)

  14. C. Wang, X. Li, H. Hu, L. Zhang, Z. Huang, M. Lin, Z. Zhang, Z. Yin, B. Huang, H. Gong, S. Bhaskaran, Y. Gu, et al., "Monitoring of the central blood pressure waveform via a conformal ultrasonic device." Nature Biomedical Engineering 2(9), 2018. (URL: https://www.nature.com/articles/s41551-018-0287-x?report=reader)

  15. P. Yang, X. Zhao, Y. Liu, and Y.Gu. "Facile, large-scale, and expeditious synthesis of hollow Co and Co@Fe nanostructures: application for electromagnetic wave absorption." The Journal of Physical Chemistry C 121(15), 2017. 

  16. Y. Wen, X. Zhao, Z. Chen, Y. Gu, Y. Wang, Z. Chen, X. Wang, "Reliability enhancement of Sn-1.0 Ag-0.5 Cu nano-composite solders by adding multiple sizes of TiO2 nanoparticles." Journal of Alloys and Compounds 696, 2017. 

  17. Y. Wang, X. Zhao, X. Xie, Y. Gu, Y. Liu, "Effects of nano-SiO2 particles addition on the microstructure, wettability, joint shear force and the interfacial IMC growth of Sn3.0Ag0.5Cu solder." Journal of Materials Science: Materials in Electronics 26(12), 2015.

  18. P. Chen, X. Zhao, Y. Wang, Y. Liu, H. Li, Y. Gu, "Enhancement of mean-time-to-failure of Sn3.0Ag0.5Cu solder bump joint under current stressing via controlling bump shape." Journal of Materials Science: Materials in Electronics 26(3), 2015. 

  19. X. Xie, X. Zhao, Y. Liu, J. Cheng, B. Zheng, Y. Gu, Materials Science Forum 815, 2015. 
     

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